In 3DICs how to account for electrical and thermal coupling between dies.
Multi-die designs, 2.5D and 3D, have been rising in popularity as they offer tremendously increased levels of integration, a smaller footprint, performance gains and more. While they are attractive for many applications, they also create design bottlenecks in the areas of thermal management and power delivery. For 3DICs, in addition to the complex SoC/PCB interactions seen in their 2D counterparts, we must account for electrical and thermal coupling between dies as well.
Traditionally, thermal, power and signal integrity analysis of each SoC is done independently with margins or guard-bands based on historical/empirical experience. As we move to 3DICs, this approach can lead to over/under design or silicon failures, and it becomes increasingly important to use comprehensive multi-die workflows with foundry-certified accuracy for such multiphysics simulations; this can be further extended to include mechanical stability issues like PCB warpage and electromagnetic coupling between adjacent high speed signal tracks.
This webinar will spotlight a detailed analysis of Ansys’ signoff solution for next-generation 3DIC systems, including:
Clickhereto read more.
New applications require a deep understanding of the tradeoffs for different types of DRAM.
How customization, complexity, and geopolitical tensions are upending the global status quo.
imec’s compute roadmap; U.S. targets Huawei; India-U.S. task force; China-Bolivia deal; Bruker uncorks white-light interferometry systems; Samsung quantifies sustainability; McKinsey identifies fab construction issues in U.S.; stacked LEDs.
It’s possible for FPGAs to be small, low power, and cost-effective.
A panel of experts tackles the potential of 2D materials, 1,000-layer NAND, and new ways of recruiting talent.
Less precision equals lower power, but standards are required to make this work.
New applications require a deep understanding of the tradeoffs for different types of DRAM.
113 startups raise $3.5B; batteries, AI, and new architectures top the list.
127 startups raise $2.6B; data center connectivity, quantum computing, and batteries draw big funding.
Thermal mismatch in heterogeneous designs, different use cases, can impact everything from accelerated aging to warpage and system failures.
New memory standard adds significant benefits, but it’s still expensive and complicated to use. That could change.
Technical and business challenges persist, but momentum is building.
该行业似乎认为我s a real goal for the open instruction set architecture.
Leave a Reply