麻省理工学院的研究人员,延世大学(首尔,韩国)发表技术论文题为“界面分层的多层薄膜半导体器件。”According to the abstract "In this work, the effect of thermomechanical stress on the failure of multilayered thin films on Si substrates was studied using analytical calculations and various thermomechanical tests." ...
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