Wirebond IC基板:挑战


基板供应商削减产能分配给wirebond IC基板。我们听到“遮盖能力有限”,“不支持EBS设计”和“etchback转换”的设计要求。所有这一切意味着什么呢?让我们先从“线”和“空间”。"Line" is the width of a trace on a substrate and "Space" is the distance between the two traces. For wirebond packages such a...»阅读更多

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