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tag:Singapore University of Technology and Design

Research Bits: March 14
ByJesse Allen- 14 Mar, 2023 - Comments: 0

Shift register-in-memory architecture Researchers at the Singapore University of Technology and Design propose a new reconfigurable shift register-in-memory architecture for devices that can work both as a reconfigurable memory component and as a programmable shift register. The device is based on phase-change alloys, which can switch reversibly between the glassy amorphous state and the or...» read more

Week In Review: Design, Low Power
BySusan Rambo- 24 Feb, 2023 - Comments: 0

Keysight Technologies acquired Cliosoft, add IP data management and design data to Keysight’s EDA portfolio. “The bigger vision is how we’re going to manage silicon lifecycle, from spec to tape-out. So you can have a data management and IP management layer and visibility into that data, and that ties into Keysight’s design and test software," said Simon Rance, vice president of marketi...» read more

Week In Review: Design, Low Power
ByJesse Allen- 10 Feb, 2023 - Comments: 0

Arm is heading for an IPO this year, with plans "fairly well developed and underway now," CEO Rene Haas told Reuters. Arm reported fiscal Q3 revenue of $746 million, up 28% compared with the same period in 2021, setting the stage for a public offering. The company noted it had double- or triple-revenue increases in automotive, consumer, infrastructure, and IoT. The Si2 Compact Model Coalit...» read more

Efficient Ohmic contacts and built-in atomic sublayer protection in MoSi2N4 and WSi2N4 monolayers
ByTechnical Paper Link- 10 Dec, 2021 - Comments: 0

Abstract "Metal contacts to two-dimensional (2D) semiconductors are often plagued by the strong Fermi level pinning (FLP) effect which reduces the tunability of the Schottky barrier height (SBH) and degrades the performance of 2D semiconductor devices. Here, we show that MoSi2N4 and WSi2N4 monolayers—an emerging 2D semiconductor family with exceptional physical properties—exhibit stron...» read more

Power/Performance Bits: Dec. 6
ByJesse Allen- 06 Dec, 2021 - Comments: 0

可调二维半导体的研究人员罪gapore University of Technology and Design (SUTD), Hengyang Normal University, Nanjing University, National University of Singapore, and Zhejiang University identified a family of 2D semiconductors that could have lower resistance and enable further scaling. “Due to the quantum tunnelling effect, shrinking a silicon-based transistor too sm...» read more

Power/Performance Bits: Nov. 2
ByJesse Allen- 02 Nov, 2021 - Comments: 0

GaN CMOS ICs Researchers from the Hong Kong University of Science and Technology (HKUST) are working to increase the functionality available to wide bandgap gallium nitride (GaN) electronics. GaN is frequently used in power electronics, such as power converters and supplies. However, GaN CMOS technology has been hampered by the difficulties in implementing p-channel transistors and integrat...» read more

Power/Performance Bits: Oct. 5
ByJesse Allen- 05 Oct, 2021 - Comments: 0

Modeling resistive-switching memory Researchers from Singapore University of Technology and Design (SUTD) and Chang Gung University developed a new toolkit for modeling current in resistive-switching memory devices. The team said that traditional physical-based models need to consider complex behaviors to model current in resistive memory, and there's a risk of permanent device damage due t...» read more

Modeling electrical conduction in resistive-switching memory through machine learning
ByTechnical Paper Link- 04 Oct, 2021 - Comments: 0

Published in AIP Advances on July 13, 2021. Read the full paper (open access). Abstract Traditional physical-based models have generally been used to model the resistive-switching behavior of resistive-switching memory (RSM). Recently, vacancy-based conduction-filament (CF) growth models have been used to model device characteristics of a wide range of RSM devices. However, few have focused o...» read more

Power/Performance Bits: Nov. 19
ByJesse Allen- 19 Nov, 2019 - Comments: 0

量子通信芯片南洋研究员Technological University, Australian National University, A∗STAR, University of Science and Technology of China, Singapore University of Technology and Design, Sun Yat-sen University, Beijing University of Posts and Telecommunications, and National University of Singapore built an integrated silicon photonic chip capable of performing quantu...» read more

Manufacturing Bits: Oct. 1
ByMark LaPedus- 01 Oct, 2019 - Comments: 0

3D balloon printing Using an elastomeric or stretchy balloon, the University of Houston and the University of Colorado have developed a new 3D printing method as a means to develop three-dimensional curvy electronic products. The technology involves the field of 3D printing, sometimes known as additive manufacturing (AM). In 3D printing, the goal is to develop parts layer-by-layer using mat...» read more

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